Themal Shock Test Chamber HTSD-100
About
| Uniform thermal stress performances The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field. |
| |
Meeting International Standards
The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS. | Reduced power consumption
Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%. | |
Specifications | Model | Temperature range | Inside / Outside dimensions （mm） | | TSD-100 | High temp. exposure: +60 to +200°C [+140 to +392°F]
Low temp. exposure: -65 to 0°C [-85 to +32°F] | W710xH345xD410 / W1100xH1885xD1965 | | Features - Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）. - Excellent temperature uniformity
ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results. - STT function （Specimen Temperature Trigger）
The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy. - Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely. | - Specimen temperature recovery （example）
（based on MIL-883 condition C）
Test conditions
High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg | Temperature uniformity measurement method
Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. （Specimens with embedded thermocouples were placed beneath other ICs.） |  - Temperature uniformity performance （example）
Test conditions
High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs （×10） | Temperature uniformity measurement method
Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. | 
Test time comparison （example）
Test conditions
High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions | Measurements
Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month. | | Tset Standards Compatible test standards IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. （General）
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition Options - Paperless recorder
- Temperature recorder （digital）
- Recorder terminal
- STT 3-point Expansion
- Specimen temperature measuring thermocouple
- Total cycle counter
- Additional cable port
- Cable port rubber plug
- Specimen basket/ shelf bracket
- Chamber dew tray
- External alarm terminal
- Fixture for securing body
- Communication cables
- Viewing window
- Exposure signal output
| - Temperature recorder for future installation
- Heavy-duty shelves
- Casters
- Additional overheat protector
- Emergency stop switch
- Communication functions
- Power cord
- Additional overheat protector
- Auxiliary cooling injector （LN2 or LCO2）
| |
Themal Shock Test Chamber HTSD-100
About
| Uniform thermal stress performances The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field. |
| |
Meeting International Standards
The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS. | Reduced power consumption
Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%. | |
Specifications | Model | Temperature range | Inside / Outside dimensions （mm） | | TSD-100 | High temp. exposure: +60 to +200°C [+140 to +392°F]
Low temp. exposure: -65 to 0°C [-85 to +32°F] | W710xH345xD410 / W1100xH1885xD1965 | | Features - Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）. - Excellent temperature uniformity
ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results. - STT function （Specimen Temperature Trigger）
The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy. - Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely. | - Specimen temperature recovery （example）
（based on MIL-883 condition C）
Test conditions
High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg | Temperature uniformity measurement method
Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. （Specimens with embedded thermocouples were placed beneath other ICs.） | - Temperature uniformity performance （example）
Test conditions
High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs （×10） | Temperature uniformity measurement method
Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. |
Test time comparison （example）
Test conditions
High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions | Measurements
Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month. | | Tset Standards Compatible test standards IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. （General）
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition Options - Paperless recorder
- Temperature recorder （digital）
- Recorder terminal
- STT 3-point Expansion
- Specimen temperature measuring thermocouple
- Total cycle counter
- Additional cable port
- Cable port rubber plug
- Specimen basket/ shelf bracket
- Chamber dew tray
- External alarm terminal
- Fixture for securing body
- Communication cables
- Viewing window
- Exposure signal output
| - Temperature recorder for future installation
- Heavy-duty shelves
- Casters
- Additional overheat protector
- Emergency stop switch
- Communication functions
- Power cord
- Additional overheat protector
- Auxiliary cooling injector （LN2 or LCO2）
| |
HTSD-100
About
| Uniform thermal stress performances The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field. |
| |
Meeting International Standards
The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS. | Reduced power consumption
Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%. | |
Specifications | Model | Temperature range | Inside / Outside dimensions （mm） | | TSD-100 | High temp. exposure: +60 to +200°C [+140 to +392°F]
Low temp. exposure: -65 to 0°C [-85 to +32°F] | W710xH345xD410 / W1100xH1885xD1965 | | Features - Short temperature recovery time
The two temperature zone system achieves quick specimen temperature recovery time （less than 15 min. for 10kg of ICs, at extreme temperature exposure）. - Excellent temperature uniformity
ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results. - STT function （Specimen Temperature Trigger）
The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy. - Ambient temperature recovery feature
Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely. | - Specimen temperature recovery （example）
（based on MIL-883 condition C）
Test conditions
High temp. exposure: +155°C for 30 min.
Low temp. exposure: -68°C for 30 min.
Specimens: ICs, 10 kg | Temperature uniformity measurement method
Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. （Specimens with embedded thermocouples were placed beneath other ICs.） | - Temperature uniformity performance （example）
Test conditions
High temp. exposure: +150°C for 30 min.
Low temp. exposure: -65°C for 30 min.
Specimens: ICs （×10） | Temperature uniformity measurement method
Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. |
Test time comparison （example）
Test conditions
High temp. exposure: +150°C, 15 min. after recovery
Low temp. exposure: -65°C, 15 min. after recovery
Specimens: ICs, 10kg
Control points: Upstream of sensor positions | Measurements
Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month. | | Tset Standards Compatible test standards IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. （General）
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition Options - Paperless recorder
- Temperature recorder （digital）
- Recorder terminal
- STT 3-point Expansion
- Specimen temperature measuring thermocouple
- Total cycle counter
- Additional cable port
- Cable port rubber plug
- Specimen basket/ shelf bracket
- Chamber dew tray
- External alarm terminal
- Fixture for securing body
- Communication cables
- Viewing window
- Exposure signal output
| - Temperature recorder for future installation
- Heavy-duty shelves
- Casters
- Additional overheat protector
- Emergency stop switch
- Communication functions
- Power cord
- Additional overheat protector
- Auxiliary cooling injector （LN2 or LCO2）
| |
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